Gembird TG-G3.0-01 heat sink compound 4.5 W/m·K 3 g

SKU

TG-G3.0-01

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In stock

Heatsink thermal paste grease, 3 g weight

Keep your computer's CPU cool
Practical syringe for easy application

Category: Heat Sink Compounds

More Information

More Information
SKU	TG-G3.0-01
EAN	8716309083133
Manufacturer	Gembird
Availability	Y

Description

Thermal compund (grease) for heatsinks
Helps the heat dissipation from a CPU, chipset or processor to a heatsink
Excellent thermal impedance
Perfect stability - will not separate, run, migrate, or bleed
Non capacitive or electrically conductive

Specifications

Features
Thermal resistance	0.205 °C/W
Viscosity note	76 CPS
Thermal conductivity	4.5 W/m·K
Operating temperature (T-T)	-50 - 240 °C
Product colour	Grey
Technical details
Compliance certificates	RoHS
Thermal resistance	0.205 °C/W
Viscosity note	76 CPS
Thermal conductivity	4.5 W/m·K
Operating temperature (T-T)	-50 - 240 °C
Weight & dimensions
Width	120 mm
Depth	180 mm
Height	15 mm
Weight	3 g
Package width	120 mm
Package depth	180 mm
Package height	15 mm
Package weight	33 g

Packaging data
Package width	120 mm
Package depth	180 mm
Package height	15 mm
Package weight	33 g
Operational conditions
Operating temperature (T-T)	-50 - 240 °C
Colour
Product colour	Grey

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SKU	TG-G3.0-01	HEATGREASE20	701662	CT-9010001-WW	AK-T565-5G	ACTCP00059A
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Type	N/A	N/A	Thermal paste	Thermal paste	Thermal paste	Thermal paste